Wafer-Level Optic Solutions

Wafer-Level Optic Solutions

Applications

Micro-optics and substrates

Refractive and difractive optical elements (ROEs & DOEs)

3D sensors, optics, spacers, heat sinks, and camera optics

Beam shaping elements

Homogenizers and optical sensors

RF components

Nanoimprint lithography substrates

Hard disk masters and molds

Blazed-wavelength and sub-wavelength difraction gratings

Beneits of Wafer-Level Optic Solutions

Various melting and forming methods enable signiicant volume supply of high-precision wafers with lowest

thickness variation: part to part and batch to batch

Compatible with wafer-level optic and semicon manu- facturing processes anlegacy

equipment and tools

Supporting capabilities include ceramics, automated laser glass-cutting,

photostructuring, bonding, dicing, and coatings

Best-in-class metrology minimizes reliability risks and enables ine resolution data

across the full wafer

Fracture mechanics glass strength experts available to train and consult on many

applications

Material Properties and Attributes

Diameters: 100/150/200/300 mm

Diameter tolerance*: +/- 0.200 mm

Thickness range: 0.10-5.0 mm

Thickness tolerance*: +/- 0.020 mm

Available upon request: Various sizes/shapes/features, semi notch/lat speciications, laser serialization, laser processing, structuring, holes, bonding, coatings

Large volume capacity: up to 60k WPM

Typical lead-time: 2-12 weeks

Polish scratch/dig: 20/10 to 80/50 per military spec

World-class MSP metrology

*Other tighter tolerances available upon request

Multiple Compositions* for Diverse Applications

*Active glasses shown here; Others available upon request

Typical Properties and Attributes