Electron Beam Evaporation Deposition System
- Product Item : AT60041
- Category： Semiconductor Coating & Deposition Equipment
- Product description：
Electron Beam Evaporation Deposition System
Heating Methods: Resistance/Radiation Heating (Can be used with inert gases and oxygen)
Sample Stage Features: Integrated resistance heating and liquid nitrogen cooling
Design Features: Quick-open door and anti-contamination plate for easy maintenance
Deposition Process Control: Fully automated control
Sample Stage Movement: Rotation, elevation, translation, and tilting capabilities
Interconnection Options: Compatible with PLD/Magnetron Vacuum Systems via loading chamber/glove box
Integration Options: Can be integrated with thermal evaporation/ion beam-assisted deposition
Ultra-High Vacuum Compatibility: Available as an option
Equipment Parameters:
|
Parameter |
Description |
|
Vacuum Chamber Dimensions |
450mm×450mm×500mm, 500mm×500mm×700mm, 600mm×600mm×1000mm |
|
Chamber Material |
304/316 Stainless Steel, Electropolished |
|
Vacuum System |
Molecular Pump/Cryopump + Mechanical Pump |
|
Ultimate Vacuum |
9×10⁻⁶Pa / 9×10⁻⁷Pa |
|
E-Type Electron Gun |
Voltage 6KV-10KV, with XY deflection scanning |
|
Crucible Options |
4-well, 6-well, 8-well, and ring types available; 12cc, 22cc, 40cc, etc. |
|
Power |
6KW～10KW, other power options available upon request |
|
Substrate Size |
2-4 inches, 2-6 inches, 2-8 inches |
|
Heating Temperature |
Up to 900℃ |
|
Cooling Stage |
Water-cooled/liquid nitrogen cooling, with temperature control from -150℃ to room temperature |
|
Rotation/Tilting |
Rotation and tilting capabilities |
|
Film Thickness Monitoring |
Film thickness measurement accuracy: 0.03Å, deposition rate measurement accuracy: 0.1Å/S; imported and domestic options available based on customer needs |
|
Electrical Control System |
PLC |
|
Alarm and Protection |
Comprehensive program interlocking, complete anti-misoperation design and protection |
|
Process Gases |
Optional |
|
Cooling System |
Water flow, water pressure, and water temperature monitoring |
|
High-Throughput Functionality |
Optional |
|
Optional Features |
Loading chamber/ion beam-assisted deposition/glove box/thermal evaporation/vacuum interconnection |
